India Set to Roll Out Electronics Components Scheme: IT Minister

In a major step toward making India a global electronics manufacturing hub, the Union government is set to roll out its long-anticipated electronics components manufacturing scheme. Union IT Minister Ashwini Vaishnaw announced that the guidelines are nearly finalised and the application portal will go live in the coming days.

The scheme aims to scale domestic production of critical components such as printed circuit boards (PCBs), PCB assemblies, electromechanical parts, passive components, and camera modules. Speaking at the launch of VVDN Technologies’ mechanical innovation park and surface mount technology (SMT) line in Manesar, Vaishnaw said, "I would prefer even the entire camera is made in India," underscoring India's growing capabilities in precision manufacturing.

He further emphasized India’s vision to broaden its base in component manufacturing while achieving deep expertise in key areas. Highlighting the country's progress, Vaishnaw noted that AI servers are already being designed and built within India, and the larger goal is to localise the entire electronics value chain—including smartphone design, chip manufacturing, and PCBs—to enhance technological self-reliance and national security.

India’s robust intellectual property approach and design-focused strategies, he said, will set the country apart globally. On geopolitical concerns and U.S. tariffs, he added, “The industry feels they will be able to figure out alternatives.” India is targeting electronics exports worth USD 500 billion by 2030–31, with developed nations increasingly sourcing from its maturing electronics ecosystem.