Advanced Tapes for Modern Needs

The Indian industrial tapes market is growing at a rapid pace due to the rising requirement in the sectors such as automotive, electronics, construction, and packaging. The market in India has witnessed a recent spurt in activity that derives from the country's robust industrialization and infrastructure development. The Asia Pacific market in industrial tapes is largely driven by India as a part of the Asia Pacific region and is expected to remain consistent throughout the forecast period of 2032. Rising use of industrial tapes in automotive manufacturing for vehicle assembly and maintenance and in electronics, where tapes are used for insulation, sealing and component assembly are key factors fueling this growth in India.

Moreover, the construction industry is a large user of industrial tapes for sealing, bonding and insulation, matching with India’s large infrastructure and real estate development. High performance tapes have become important for tapes with special properties like heat resistant, durability, and high adhesive strength in demand to package, construction and electronic applications. There is also a growing trend towards the use of eco-friendly materials and manufacturers are moving away from traditional solvent based adhesives to more sustainable adhesive systems. India is at the forefront of being one of the most attractive markets for global players who introduce innovations to meet local needs and regulatory norms. Ongoing advancements in technological arena, especially in the adhesive formulations and tape materials will make the industrial tapes market in India sustain its growth momentum for the next decade.

In this special issue, we introduce you to the top manufacturers in this segment. Industry Outlook has identified the select few companies that have done particularly well in this sector with a high level of dedication. We have found that these companies have gone the extra mile in proving their commitment to meet the customer needs in an integrated manner.

We welcome your feedbacks and suggestion that you may have concerning this special issue.