KYOCERA AVX, a leading global manufacturer of advanced electronic components designed to accelerate technological innovation, has launched the new ultra-low-ESR KGU Series C0G (NP0) RF multilayer ceramic chip capacitors (MLCCs).
The new KGU Series RF MLCCs are designed to meet the increasing demand in the communications market for smaller RF capacitors that offer consistent RF performance. These capacitors come in four miniature EIA chip sizes ranging from 01005 to 0805 and are tailored for communications applications. The series features Class I C0G (NP0) ceramic dielectric materials, known for their stability and exhibiting a temperature coefficient of capacitance (TCC) of 0±30ppm/°C and essentially zero voltage coefficient. The capacitors also feature base metal electrodes made of copper plated with a tin/nickel alloy, providing high capacitance-voltage (CV) capabilities in small case sizes. Additionally, they offer ultra-low equivalent series resistance (ESR), high power, high Q, high self-resonant frequencies (SRF), and tight tolerances, making them ideal for various communications applications.
The KGU Series RF MLCCs are available in four miniature EIA chip sizes (number_1, 0402, 0603, and 0805) and are rated for 16–250V, 0.1–100pF, tolerances as low as ±0.05pF, and operating temperatures extending from -40°C to +125°C. These capacitors are suitable for applications such as filter networks, matching networks, high-Q frequency sources, and tuning, coupling, bypass, and DC blocking circuits in cellular base stations, 802.11 Wi-Fi networks, subscriber-based wireless devices, and broadband wireless, satellite communications, and public safety radio systems.
Other features of the KGU Series RF MLCCs include RoHS compliance, resistance to thermal shock, long lifetime performance, lack of aging and piezoelectric effects, and tape and reel packaging for automated assembly.
Mohammed Abu-Naim, RF Product Manager at KYOCERA AVX, expressed, “Our new KGU Series C0G (NP0) RF MLCCs are designed to meet the specific demands of the communications market, including ultra-low power, high repeatability, high power, high Q, high SRF, tight tolerances, and miniature EIA chip sizes.”
