| |August 20219intelligence (AI) modules, and radio frequency (RF) modules for wireless communication and data transfer.The trend of modularization increasingly manifests itself not only in consumer, computer and communication products such as smartphones, smartwatches, smart speakers, notebooks, etc. but also in all other areas of electronics including industrial, automotive and medical applications.Interconnect solutions consisting of printed circuit boards and IC substrates using embedding as one of the key technologies for the integration of modules with a growing number of functions make a significant contribution to supporting the trend of modularization. They shorten electrical lines between the components and save space.Printed Circuit Boards and interconnect solutions for consumer, communication and computer applications ("CCC") are additionally characterized by the necessity of providing minimum trace widths for high levels of integration in large production volumes. Automotive, industrial and medical applications (AIM) use high end technologies with reduced trace widths from CCC as a platform for further innovation. Application trends such as connectivity to exchange the maximum possible data volumes (Internet of things, machine to machine communication) or artificial intelligence (autonomous driving, automation robotics) requiring especially high data processing and computing capability lead to an ever stronger convergence of the technological requirements and roadmaps in the individual market segments.These application trends follow the megatrend to enable not only higher and higher computing power and connectivity with higher data rates, increasingly also the interaction of devices with the environment. Among other things, this drives the development of increasingly better and smaller cameras and other types of optical, position and environmental sensors, miniaturized speakers, etc. Significant improvements in connectivity will allow de facto "real time applications" for mobile devices, robotics, and autonomous driving. Another important global trend is the goal of preventing emissions, which advances the electrification of vehicles. This, like autonomous driving, will be yet another important application driver for increased electronics in cars. These trendsetting applications can only be realized with highly advanced interconnect solutions as an increasingly significant part of the system as a whole. Modularization is opening up considerable growth potential for high end printed circuit board and IC substrate producers like AT&S by proactively entering into development partnerships with customers.With enabling facilitations for industry to ride this technology trend, the ambitions for 5 trillion dollar economy in country would become more tangible.
< Page 8 | Page 10 >